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Ion sputtering

Ion sputtering is used for sample cleaning from adsorbates or deposits. If you do not have yet your optimized sample cleaning procedure you can look for information in the Musket's article or on the BACH beamline dedicated webpage.

There are two similar power supplies for the sputter ion guns. The difference is that one power supply has filament switch and beam energy indicator on the front panel, while the other one has the filament switch from the back and the beam energy is indicated only by the scale on the corresponding knob. Check which power supply is connected to which sputter ion gun.



Experimental chamber

  1. Check that LEED, electron analyzer, X-ray source, evaporators, titanium sublimation pump etc. are off and that all gate valves to other chambers are properly closed and that the fan on the ion gun is on.
  2. Set the sample position (approximately x = 25, y = 25, z = 262, Θ = 275° for sputtering angle 45°).
  3. Open the Ar leak valve to set the pressure in the chamber to 2×10-6 mbar.
  4. Switch on the power supply.
  5. Set the emission to 14 mA using the emission knob. At the beginning the indicator will not react, then it will jump as the feedback loop is synchronized.
  6. Switch on beam energy and adjust the energy by the knob (usually 1 keV).
  7. Start the timer for the desired sputtering time (usually 10-60 minutes). During the sputtering adjust the pressure if needed.
  8. Switch off the beam energy, set emission to zero, switch off the power supply.
  9. Close the Ar leak valve. Do not use force. Wait for the pressure in the chamber to recover.

Preparation chamber - bottom

  1. Check that all sensitive instruments (evaporators, titanium sublimation pump) in the chamber are off and that all gate valves to other chambers are properly closed.
  2. Set the sample position by the transfer rod approximately in the center of the chamber. Leave the sample either horizontally or vertically for sputtering angle 45°.
  3. Open the Ar leak valve to set the pressure in the chamber to 2×10-6 mbar.
  4. Switch on the power supply.
  5. Set the emission to 14 mA using the emission knob. At the beginning the indicator will not react, then it will jump as the feedback loop is synchronized.
  6. Switch on beam energy and adjust the energy by the knob (usually 1 keV).
  7. Start the timer for the desired sputtering time (usually 10-60 minutes). During the sputtering adjust the pressure if needed.
  8. Switch off the beam energy, set emission to zero, switch off the power supply.
  9. Close the Ar leak valve. Do not use force. Wait for the pressure in the chamber to recover.

Last Updated on Tuesday, 21 November 2017 09:24