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Spin-Charge Conversion in Sb2Te3-based heterostructures

Spin-charge interconversion (SCIC) refers to the conversion of pure charge currents into pure spin currents and vice versa. These fundamental phenomena can be exploited to generate and manipulate electronic states for use in spin-based logic and memory devices. A wide variety of materials with high spin-orbit coupling, including topological insulators (TIs), are emerging as promising candidates for the implementation of SCIC devices. Although TIs are insulating in the bulk, they exhibit spin-polarized conductive electronic states localized on their surfaces. These states, known as topological surface states (TSSs), exhibit spin-momentum locking, meaning their spin and momentum directions are mutually orthogonal in reciprocal space. This property of TIs makes them particularly attractive for the design of efficient SCIC devices. TSSs are robust against nonmagnetic disorders, such as defects and impurities, but are disrupted by the proximity of magnetic materials, which are essential parts of SCIC device. To practically utilize TI in devices, it is necessary to devise a method to separate the TI from the magnetic material while keeping the TSS properties unaffected.

In this study, we explored Au and Al metals, which are widely used in the electronics industry, as spacer materials between a TI (Sb2Te3) and a magnetic (Co) film. Both materials have large spin diffusion lengths and, therefore, are suitable for supporting spin-polarized currents. Spin-pumped ferromagnetic resonance imaging (SP-FMR) studies showed that a high rate of spin-to-charge conversion is detected in a device based on the Sb2Te3/Au/Co heterostructure (Fig. 1a), while no conversion is observed when considering the Sb2Te3/Al/Co heterostructure (Fig. 1b). 

Figure 1 from the top-stroy by E. Longo et al., ACS Nano 2025

Figure 1(a) Spin pumping measurements show efficient spin-charge conversion for the Sb2Te3/Au/Co heterostructure. (b) The conversion is suppressed in the Sb2Te3/Al/Co heterostructure.

To understand this difference in functional behavior, we analyzed the electronic and chemical properties of the interface between the TI and the Au and Al layers by performing angle-resolved photoemission spectroscopy (ARPES) experiments and core-level analysis at the high-resolution VUV-Photoemission beamline of Elettra. Au and Al were thermally evaporated under ultrahigh vacuum conditions onto in-situ exfoliated Sb2Te3 single crystals. 

The ARPES spectra demonstrate that the Sb2Te3 TSS is still observable after the deposition of a 0.9 nm thick Au film (Fig. 2a) and retains the same energy-momentum dispersion as the clean TI surface, albeit with reduced intensity. In contrast, after the deposition of 1 nm Al a clear qualitative change of the TSS dispersion is observed (Fig. 2c). We found that the origin of this behavior lies in the different chemical reactivity of Au and Al with the TI surface. Core-level photoemission spectroscopy shows that the Sb2Te3/Au interface is sharp, with a Te 4d doublet remaining almost unchanged compared to that of the freshly exfoliated substrate (see Fig. 2b). By contrast, after Al evaporation, the same core level peak exhibits a notable change in shape, with the appearance of an additional component on the high binding energy side indicative of Al-Te alloy formation (Fig. 2d). 

Figure 2 from the top-stroy by E. Longo et al., ACS Nano 2025

Figure 2: a, b) ARPES and Te 4d core level spectrum of Sb2Te3 after deposition of 1 nm of Au. c, d) ARPES and Te 4d core level spectrum of Sb2Te3 after deposition of 0.9 nm of Al.

Our results highlight the importance of choosing a suitable non-magnetic interlayer to preserve the TSS, as well as the influence of material chemistry on SCIC phenomena, highlighting the key role of the TSS in spin-charge conversion processes in Sb2Te3 TI-based devices.

This research was conducted by the following research team:

E. Longo1, M. Belli2, C. Wiemer3, A. Lamperti3, A. V. Matetskiy4, P. M. Shevedyaeva4, P. Moras4, M. Fanciulli5, and R. Mantovan3

1 Institut de Ciència de Materials de Barcelona (ICMAB-CSIC), Campus UAB, Bellaterra, Catalonia, Spain
2 CNR-IMEM Unit of Parma, Parco area delle Scienze, Parma, Italy
3 CNR-IMM, Unit of Agrate Brianza, Agrate Brianza, Italy
4 CNR-ISM Unit of Trieste, Trieste, Italy
5 Department of Material Science, University of Milano Bicocca, Milano, Italy

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Reference

E. Longo, M. Belli, C. Wiemer, A. Lamperti, A. V. Matetskiy, P. M. Sheverdyaeva, P. Moras, M. Fanciulli, and R. Mantovan, “Influence of Metal Interlayers on Spin-Charge Conversion in Sb2Te3 Topological Insulator-Based Devices", Nano Lett. 25(17), 6888 (2025); DOI: 10.1021/acs.nanolett.4c06658.

Last Updated on Monday, 23 June 2025 17:22